Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future? Chapters discuss: failure sites, operational loads, and failure mechanism intrinsic device sensitivities electromigration hot carrier aging time dependent dielectric breakdown mechanical stress induced migration alpha particle sensitivity electrostatic discharge (ESD) and electrical overstress latch-up qualification screening guidelines for designing reliability Guidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.

Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them.

This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future?

Chapters discuss:
o failure sites, operational loads, and failure mechanism
o intrinsic device sensitivities
o electromigration
o hot carrier aging
o time dependent dielectric breakdown
o mechanical stress induced migration
o alpha particle sensitivity
o electrostatic discharge (ESD) and electrical overstress
o latch-up
o qualification
o screening
o guidelines for designing reliability

Guidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.

American Literary Studies in Postmillennial India: Critical Perspectives is a collection of critical essays on Contemporary American Literature. This book is a classic and unique collection of critical essays on various topics such as Americanness, American Dream, Transcendentalism, Counterculture, Gay culture, Post Communism, Race, Class, Gender in American Literature, African American literature, Jewish American literature, and comparative study between Indian and American Literature. The essays cut across the various genres of poetry, theatre, fiction and short stories. This book is the first of its kind, as all the collection of essays have been written by eminent professors across India, Full Bright Fellows, and serious research scholars of high repute who have contributed remarkably to American Studies both in India and across the globe.